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Sabtu, 19 April 2008 |
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OCZ Technology Group today unveiled a blazing fast DDR3 addition to the new Flex II memory series. These premium modules run at incredibly fast 2000MHz speeds at CL8-8-8 timings for added performance to high-end systems with integrated water-cooling. Designed to the very core to offer enthusiasts the thermal management innovation of hybrid water and passive cooling, the new PC3-16000 Flex II Series offers rock-solid stability and performance for your high-end gaming or overclocking system.
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Sabtu, 19 April 2008 |
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BenQ today expands its Joybook R series lineup with the launch of Joybook R45. Powered by a 2.10 GHz Intel Core 2 Duo processor, the Joybook R45 features an extra-bright 14.1” widescreen display enhanced by the BenQ’s patented UltraVivid technology, an integrated 2-megapixel webcam for video calls and a luxurious leather-like finish with special soft-touch coating. The Joybook R45 also comes equipped with the best-of-class nVIDIA® GeForce® 8400M G discrete graphics and supports major WiFi standards, keeping you connected at much faster speed.
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Kamis, 17 April 2008 |
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Hitachi today announced the Ultrastar 15K450. The new drive uses perpendicular magnetic recording (PMR) technology to deliver 450GB of storage, currently the highest available capacity in 15,000 RPM enterprise-class hard drives. The Ultrastar 15K450 is an ideal solution for mission-critical server and storage applications, such as online transaction processing, intensive database queries and other multi-user applications.
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Kamis, 17 April 2008 |
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Silicon-Power releases its DDR3 memory modules - DDR3 1333 SDRAM Unbuffered DIMM. It uses the newest design of ASR (Automatic Self-Refresh), which can reduce the refreshing frequency of memory modules thus successfully reduce the temperature and power consumption. Moreover, DDR3 supplies voltage has been decreased from 1.8V to 1.5V, hence reducing power consumption by 30% compared to the DDR2. Silicon-Power DDR3 1333 provides better system stability and reliability.
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Sabtu, 12 April 2008 |
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G.Skill announced the new heat spreader design for mid-high end memory. Based on providing better heat dissipation, G.Skill "π" series heat spreader design increases the air contact surface 100% more than traditional design.
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