Tans Computer

G.Skill announced the new heat spreader design for mid-high end memory. Based on providing better heat dissipation, G.Skill "π" series heat spreader design increases the air contact surface 100% more than traditional design.

Lower Temperature = Lower Power Consumption

All users are pursuing higher system performance. Memory frequency is one of the key factors. According to the theory, higher memory frequency takes higher power consumption as the higher Vdimm needed. G.Skill  "π" series heat spreader design takes more heat out from the memory IC surface. It can lower the temperature at least 20% to 30% more than the traditional design.

Lower Temperature = More System Performance

For Overclockers, every degree is also the matter. As per semiconductor characteristic, too high temperature will limit the working frequency, OC capability, and product life. G.Skill "π"  series heat spreader design allows overclockers to squeeze their memory performance more than the past. For the serious gamers, they can avoid be killed dues to the system lag.

G.Skill  "π" series product list

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